Despite another year of new Apple officially introduced the next generation iPhone, but many features that can be fitted to the iPhone 7 and iPhone 7 Plus has revealed.
1. Chipset Apple A10
Almost obvious Apple will upgrade the chipset in the next generation iPhone, and it may be a chip A10. Currently, the duo iPhone 6S and 6S Plus is equipped with 64 bit A9 chip with a powerful performance. It is the perfect processor by process of TSMC 16 nm or 14 nm of Samsung. It is still too early to mention the features of the A10 chipset, but the sources said Apple will choose TSMC is the exclusive supplier.
2. 3 GB RAM
iPhone 6S / 6S Plus is the first generation of Apple increased the size of RAM since the iPhone 5 so far. With 2 GB and the optimization of the operating system iOS, iPhone 6s and 6s Plus always gives great processing speed. According to analyst Kuo Ming-Ci, Apple will continue to increase the amount of RAM up to 3GB for iPhone 7 Plus, separate iPhone version 7 will retain a 2 GB as the current generation.
3. Durable better, better waterproofing
The chassis of the iPhone 6S / 6S Plus has provided more than 7000 constituted monolithic aluminum, but the recently confirmed rumors iPhone ruggedness 7 still further. In addition, Apple may also join the smartphone market will likely waterproof iPhone 7 and 7 Plus, this was partly revealed from the silicon buffer that the company equips iPhone 6s to increase resistance wet.
4. Slim design
Many rumors confirmed iPhone 7 will surpass 6.9 mm thickness of the iPhone 6 to become the next-generation thinnest iPhone ever.
New Thin expected around 6.0 to 6.5 mm, combined with a solid frame and resistant, iPhone 7 will become a great smartphone that anyone wants to own.
5. The new screen technology
To meet the demand for thinner, iPhone 7 and iPhone 7 Plus can be equipped with advanced technology monitors more. Apple is not clear exactly what will use technology to achieve this, however there are rumors that the company will replace the traditional LCD panel using the supplied OLED panel.
6. High Speed Memory
The leaked information says the duo iPhone 7 and iPhone 7 Plus will be equipped with 3D NAND memory, high-speed provided by Toshiba or SanDisk. With this new memory technology, memory chips thicker density and speed reading and writing data is also higher than the previous version.
7. There are more low-cost version
Ming-Chi Kuo predicts that Apple continued to launch a similar product next year iPhone 5C. It may be a 4-inch smartphone screen, A9 chipset, metal body, the features are reduced, such as no human touch screen 3D Touch.
Source:ytn.news
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